• Deep Snap Back ，Effectively reduce the VC residual pressure value of TVS tube.

• Using CSP packaging technology, the capacitance value of TVS tube is greatly reduced.

• Small size: DFN0603, DFN1006 package.
  

         In today's highly integrated, miniaturized and intelligent electronics market, EOS/ESD ESD protection has become 

a key factor in ensuring product stability and reliability. With the wide application of high-speed data interfaces such as 

USB 3.0/3.1 and HDMI 2.0/2.1, the EOS/ESD phenomenon is increasingly threatening to electronic products.

        Due to the high-speed signal transmission port, the signal transmission rate is very high, the parasitic capacitance 

of the protection device requirements are very strict, low parasitic capacitance ESD protection device can reduce the 

interference to signal transmission, to ensure the integrity of the signal and transmission efficiency, while in high-speed 

signal transmission, low VC is one of the key factors in the selection of protection devices. The lower the VC, the better

 the protection effect, so as to more effectively protect the post-stage chip from damage.

       To this end, UN Semiconductor uses the Deep Snap Back process combined with CSP packaging technology to 

develop high-speed signal ESD electrostatic protection devices with excellent protection effect.

1、The platform voltage can be controlled to about 2V after the flyback, and the ultra-low clamping voltage has a 

better protection effect on ESD electrostatic discharge and EOS interference of the same intensity than the conventional 

ESD protection devices.

                                                             Residual pressure test waveform

2、With a very small parasitic capacitance of 0.08PF, it can effectively avoid interference to high-speed signals 

and support higher communication rates.

                                                                Capacitance measurement diagram

This product is suitable for USB 3.0/3.1/3.2, HDMI 2.0/2.1, Serial ATA, high-definition digital video interface 

and other high-speed data transmission interface.

1、Device specification sheet

2、Application recommendation

• USB 3.0/3.1/3.2

• HDMI 2.0/2.1

• Serial ATA

• LVDS

• DP

3、Key data presentation

       UN Semiconductor has been committed to the research and development of EMC protection devices 

and technological innovation, to provide customers with better devices and protection solutions is our 

motivation. Our products have been widely used in many fields such as consumer electronics, 

communications, automotive electronics, industrial control and so on.

For technical details and sales or technical support, please feel free to contactus.

                                                                                                                                    UN semiconductor

                                                                                                                       Passive Protection Devices Division